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Home Rogers PCB Board RO4003C LoPro PCB Rogers 12.7mil Reverse Treated Foil (RTF) Circuit Board

RO4003C LoPro PCB Rogers 12.7mil Reverse Treated Foil (RTF) Circuit Board

RO4003C LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4003C dielectric.

  • Item NO.:

    BIC-129-v86.0
  • Order(MOQ):

    10
  • Payment:

    T/T
  • Market Price:

    $2.99
  • Price Range:1 - 100/$89.99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

RO4003C LoPro PCB Rogers 12.7mil Reverse Treated Foil (RTF) Circuit Board for High Speed Back Planes.

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


RO4003C LoPro laminates results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4003C laminate system.


2L 12.7mil RO4003C LoPro PCB


Features and Benefits:


RO4003C materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density


Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility


Lead-free process compatible

1.High temperature processing

2.Meets environmental concerns


CAF resistant


 RO4003C LoPro PCB


Our PCB Capability (RO4003C LoPro)


PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4003C LoPro
Dielectric constant: 3.38±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 12.7mil (0.323mm), 16.7mil (0.424mm), 20.7mil(0.526mm), 32.7mil (0.831mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..


Typical Properties of RO4003C LoPro


Property  Typical Value Direction Units Condition Test Method
Dielectric Constant, Process  3.38 ± 0.05 z -- 10 GHz/23°C IPC-TM-650                 2.5.5.5            Clamped Stripline
Dielectric Constant, Design  3.5 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan,d 0.0027 0.0021 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650     2.5.5.5
Thermal Coeffifi cient ofer 40 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 X 1010 MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 X 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 26889(3900) Y MPa(kpsi) RT ASTM D638
Tensile Strength 141(20.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 276(40) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 11 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
14 y
46 z
Tg >280 °C TMA A IPC-TM-650 2.4.24.3
Td 425 °C TGA ASTM D3850
Thermal Conductivity 0.64 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.79 gm/cm3 23°C ASTM D792
Copper Peel Strength 1.05(6.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-Free Process Compatible Yes



Typical applications are as follows:


PCB


 


MANUFACTURING PROCESS:


Rogers 4350B MANUFACTURING PROCESS


BICEHNG PCB EQUIPMENT:


Bicheng PCB Equipment


BICHENG PCB CERTIFICATE:


RO4350B DK DF PCB

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