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Home Rogers PCB Board RO4350B LoPro High Frequency 10.7mil Rogers Reverse Treated Foil PCB

RO4350B LoPro High Frequency 10.7mil Rogers Reverse Treated Foil PCB

RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric.

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RO4350B LoPro High Frequency PCB 10.7mil Rogers Reverse Treated Foil Circuit Board With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

RO4350B LoPro laminates results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.

10.7 MIL RO4350B LoPro PCB

Features and Benefits:

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

Lead-free process compatible

1.High temperature processing

2.Meets environmental concerns

CAF resistant

Our PCB Capability (RO4350B LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4350B LoPro
Dielectric constant: 3.48±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

Typical Properties of RO4350B LoPro

Property  Typical Value Direction Units Condition Test Method
Dielectric Constant, Process  3.48 ± 0.05 z -- 10 GHz/23°C IPC-TM-650                   Clamped Stripline
Dielectric Constant, Design  3.55 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan,d 0.0037    0.0031 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650
Thermal Coeffifi cient ofer 50 z ppm/°C -50°C to 150°C IPC-TM-650
Volume Resistivity 1.2 X 1010 MΩ•cm COND A IPC-TM-650
Surface Resistivity 5.7 X 109 COND A IPC-TM-650
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650
Tensile Modulus 11473(1664) Y MPa(kpsi) RT ASTM D638
Tensile Strength 175(25.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 255(37) MPa(kpsi) IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 14 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
16 y
35 z
Tg >280 °C TMA A IPC-TM-650
Td 390 °C TGA ASTM D3850
Thermal Conductivity 0.62 W/m/°K 80°C ASTM C518
Moisture Absorption 0.06 % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.86 gm/cm3 23°C ASTM D792
Copper Peel Strength 0.88(5.0) N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-Free Process Compatible Yes

Typical applications are as follows:






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