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RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric.
Item NO.:
BIC-134-v87.0Order(MOQ):
10Payment:
T/TMarket Price:
$2.99Product Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 daysRO4350B LoPro High Frequency PCB 10.7mil Rogers Reverse Treated Foil Circuit Board With Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
RO4350B LoPro laminates results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.
Features and Benefits:
RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.
1. Lower insertion loss
2. Low PIM
3. Increased signal integrity
4. High circuit density
Low Z-axis coefficient of thermal expansion
1. Multi-layer board capability
2. Design flexibility
Lead-free process compatible
1.High temperature processing
2.Meets environmental concerns
CAF resistant
Our PCB Capability (RO4350B LoPro)
PCB Material: | Hydrocarbon Ceramic Laminates |
Designation: | RO4350B LoPro |
Dielectric constant: | 3.48±0.05 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin etc.. |
Typical Properties of RO4350B LoPro
Property | Typical Value | Direction | Units | Condition | Test Method |
Dielectric Constant, Process | 3.48 ± 0.05 | z | -- | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant, Design | 3.55 | z | -- | 8 to 40 GHz | Differential Phase Length Method |
Dissipation Factor tan,d | 0.0037 0.0031 | z | -- | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
Thermal Coeffifi cient ofer | 50 | z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | z | KV/mm(V/mil) | 0.51mm(0.020”) | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 11473(1664) | Y | MPa(kpsi) | RT | ASTM D638 |
Tensile Strength | 175(25.4) | Y | MPa(kpsi) | RT | ASTM D638 |
Flexural Strength | 255(37) | MPa(kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m(mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
Coeffifi cient of Thermal Expansion | 14 | x | ppm/°C | -55 to 288°C | IPC-TM-650 2.1.41 |
16 | y | ||||
35 | z | ||||
Tg | >280 | °C TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | °C TGA | ASTM D3850 | ||
Thermal Conductivity | 0.62 | W/m/°K | 80°C | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
Density | 1.86 | gm/cm3 | 23°C | ASTM D792 | |
Copper Peel Strength | 0.88(5.0) | N/mm(pli) | after solder float 1 oz. TC Foil | IPC-TM-650 2.4.8 | |
Flammability | V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes |
Typical applications are as follows:
MANUFACTURING PROCESS:
BICEHNG PCB EQUIPMENT:
BICHENG PCB CERTIFICATE:
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