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Rogers' TMM3 high frequency laminates are
ceramic, hydrocarbon, thermoset polymer composites designed for high PTH
reliability stripline and microstrip applications.
Item NO.:
BIC-155-v106.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 daysRogers TMM3 High Frequency Printed Circuit Board 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
It has the dielectric constant of 3.27 and dissipation factor of 0.002.
TMM3 has an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM3 is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.
Since TMM3 is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.
Typical Applications
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our PCB Capability(TMM3):
PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: | TMM3 |
Dielectric constant: | 3.27 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
Why Choose Us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡workshop, 30000㎡output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3
Typical Value of TMM3:
TMM3 Typical Value | ||||||
Property | TMM3 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 3.27±0.032 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 3.45 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | +37 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | 2 x 109 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | >9x 10^9 | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 441 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 15 | X | ppm/K | 0 to 140℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 15 | Y | ppm/K | 0 to 140℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 23 | Z | ppm/K | 0 to 140℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.7 | Z | W/m/K | 80℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 16.53 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.72 | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.12 | |||||
Specific Gravity | 1.78 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.87 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
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