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Home Rogers PCB Board Rogers TMM3 High Frequency PCB 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold

Rogers TMM3 High Frequency PCB 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold

Rogers' TMM3 high frequency laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability stripline and microstrip applications.


  • Item NO.:

    BIC-155-v106.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail

Rogers TMM3 High Frequency Printed Circuit Board 15mil 30mil 60mil DK3.27 RF PCB With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description

It has the dielectric constant of 3.27 and dissipation factor of 0.002.


TMM3 has an exceptionally low thermal coefficient of dielectric constant. Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM3 is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.


TMM3 PCB bOARD


Since TMM3 is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.


Typical Applications


1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems




Our PCB Capability(TMM3):


PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM3
Dielectric constant: 3.27
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),  150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..


Why Choose Us?


1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

2.More than 18+ years’ high frequency PCB experience;

3.Small quantity order is available, no MOQ required;

4.We’re a Team of passion, discipline, responsibility and honesty;

5.Delivery on time: >98%, Customer complaint rate: <1%

6.16000㎡workshop, 30000㎡output a month and 8000 types of PCB's a month;

7.Powerful PCB capabilities support your research and development, sales and marketing;

8.IPC Class 2 / IPC Class 3


Typical Value of TMM3:


TMM3 Typical Value
Property TMM3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.27±0.032 Z 10 GHz IPC-TM-650 2.5.5.5 
Dielectric Constant,εDesign 3.45 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant +37 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 109 - Mohm.cm - ASTM D257
Surface Resistivity >9x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 441 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 15 X ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 15 Y ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 23 Z ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 16.53 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.72 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.12
Specific Gravity 1.78 - - A ASTM D792
Specific Heat Capacity 0.87 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -



MANUFACTURING PROCESS:


Manufacturing Process of Dual Layer PTH PCB


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS

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