RO4533
High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCB
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
General
Description：
It has a dielectric constant of 3.3 and a loss tangent (Df) of 0.0025
measured at 10 GHz. These values allow antenna designers to realize substantial
gain values while minimizing signal loss. Thus, it provides excellent passive
intermodulation response required for mobile infrastructure microstrip antenna
applications.
It
is an affordable alternative to more conventional PTFE antenna technologies,
thus allowing our designers to optimize the price and performance of the
antennas. The resin systems of RO4533 dielectric materials are designed to
provide the necessary properties for ideal antenna performance. The
coefficients of thermal expansion (CTEs) in both the X and Y directions are
similar to that of copper. The good CTE match reduces stresses in the printed
circuit board antenna.
Features
and Benefits:
1.
Low Loss 0.0025 , Low Dk 3.3, low PIM response: Wide range of application use
2.
Thermoset resin system: Compatible with standard PCB fabrication
3.
Excellent dimensional stability: Greater
yield on larger panels sizes
4.
Uniform mechanical properties: Maintains mechanical form during handling
5.
High thermal conductivity: Improved power handling
Typical
Applications:
1.
Cellular infrastructure base station antennas
2.
WiMAX antenna networks
Our
PCB Capability (RO4533)：
|
PCB
Material:
|
Ceramic-filled,
Glass-reinforced Hydrocarbon
|
|
Designation:
|
RO4533
|
|
Dielectric constant:
|
3.3
|
|
Dissipation Factor
|
0.0025 10GHz
|
|
Layer count:
|
Double Sided PCB, Multilayer PCB, Hybrid PCB
|
|
Copper
weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
|
|
PCB thickness:
|
20mil
(0.508mm), 30mil (0.762mm), 60mil (1.524mm
)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue,
Yellow, Red etc.
|
|
Surface
finish:
|
Bare
copper, HASL, ENIG, Immersion silver, Immersion tin, OSP etc..
|
RO4533
Typical Values:
|
Property
|
RO4533
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant, er Process
|
3.3
± 0.08
|
Z
|
-
|
10 GHz/23℃2.5 GHz
|
IPC-TM-650,2.5.5.5
|
|
Dissipation Factor
|
0.002
|
Z
|
-
|
2.5 GHz/23℃
|
IPC-TM-650,
2.5.5.5
|
|
0.0025
|
10 GHz/23℃
|
|
PIM (Typical)
|
-157
|
-
|
dBc
|
Reflected
43 dBm swept tones
|
Summitek
1900b PIM Analyzer
|
|
Dielectric Strength
|
>500
|
Z
|
V/mil
|
0.51
mm
|
IPC-TM-650,
2.5.6.2
|
|
Dimensional Stability
|
<0.2
|
X,Y
|
mm/m
(mils/inch)
|
after
etch
|
IPC-TM-650,
2.4.39A
|
|
Coefficient of Thermal Expansion
|
13
|
X
|
ppm/℃
|
-55 to 288℃
|
IPC-TM-650,
2.4.41
|
|
11
|
Y
|
|
37
|
Z
|
|
Thermal Conductivity
|
0.6
|
-
|
W/(m.K)
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.02
|
-
|
%
|
D48/50
|
IPC-TM-650,
2.6.2.1 ASTM D570
|
|
Tg
|
>280
|
-
|
℃TMA
|
A
|
IPC-TM-650,
2.4.24.3
|
|
Density
|
1.8
|
-
|
gm/cm3
|
-
|
ASTM
D792
|
|
Copper Peel Strength
|
6.9（1.2）
|
-
|
lbs/in
(N/mm)
|
1
oz. EDC post solder float
|
IPC-TM-650,
2.4.8
|
|
Flammability
|
NON
FR
|
-
|
-
|
-
|
UL
94
|
|
Lead-Free Process Compatible
|
Yes
|
-
|
-
|
-
|
-
|
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BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
Call Us Now !
Tel : +86 755 27374946
Order Online Now !
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