Shenzhen Bicheng
Electronics Technology Co., Ltd

# Call Us Now ! Tel : +86 755 27374946

# Order Online Now ! Email : info@bichengpcb.com

Hybrid PCB
Hybrid PCB
Products
Home Rogers PCB Board Rogers TMM6 Microwave 20mil 50mil 75mil DK6.0 RF PCB With Immersion Gold

Rogers TMM6 Microwave 20mil 50mil 75mil DK6.0 RF PCB With Immersion Gold

TMM6 has an exceptionally low thermal coefficient of dielectric constant. 


  • Item NO.:

    BIC-157-v107.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$2.9
  • Price Range:1 - 50/$99
  • Product Origin:

    China
  • Color:

    White
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers TMM6 Microwave Printed Circuit Board 20mil 50mil 75mil DK6.0 RF PCB With Immersion Gold

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


General Description:


Rogers' TMM6 thermoset microwave laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability stripline and microstrip applications. It has the dielectric constant of 6.0 and dissipation factor of 0.0023.


Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM6 is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.


Since TMM6 is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.


Typical Applications


1. Chip testers

2. Dielectric polarizers and lenses

3. Filters and coupler

4. Global Positioning Systems Antennas

5. Patch Antennas

6. Power amplifiers and combiners

7. RF and microwave circuitry

8. Satellite communication systems


Rogers TMM6 PCB


Our PCB Capability(TMM6)


PCB Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation: TMM6
Dielectric constant: 6
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm),  150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc..


Why Choose Us?


1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

2.More than 18+ years’ high frequency PCB experience;

3.Small quantity order is available, no MOQ required;

4.We’re a Team of passion, discipline, responsibility and honesty;

5.Delivery on time: >98%, Customer complaint rate: <1%

6.16000㎡workshop, 30000㎡output a month and 8000 types of PCB's a month;

7.Powerful PCB capabilities support your research and development, sales and marketing;

8.IPC Class 2 / IPC Class 3


Typical Value of TMM6


Property TMM6 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.0±0.08 Z 10 GHz IPC-TM-650 2.5.5.5 
Dielectric Constant,εDesign 6.3 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.0023 Z - 10 GHz IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant -11 - ppm/°K -55℃-125℃ IPC-TM-650 2.5.5.5
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 2 x 10^8 - Mohm.cm - ASTM D257
Surface Resistivity 1 x 10^9 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 362 Z V/mil - IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - x 18 X ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 18 Y ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 26 Z ppm/K 0 to 140℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.72 Z W/m/K 80℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.02 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.75 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.06 - % D/24/23 ASTM D570
3.18mm (0.125") 0.2
Specific Gravity 2.37 - - A ASTM D792
Specific Heat Capacity 0.78 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -



MANUFACTURING PROCESS:


Manufacturing Process of Dual Layer PTH PCB


BICHNEG PCB WORKSHOP:


BICHNEG PCB WORKSHOP


BICHNEG PCB CERTIFICATION: 


BICHNEG PCB CERTIFICATION


BICHENG PCB MAIN COURIERS:


BICHENG PCB MAIN COURIERS

Leave A Message

If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

Related Products
RT/Duroid 5880 High Frequency PCB
RT/Duroid 5880 20mil 0.508mm Rogers High Frequency PCB

This is a type of double sided RF PCB built on RT/duroid 5880 for the application of Radar Systems.

2 layer  60mil  RO4003C RF PCB
Rogers 4003 60mil 1.524mm RO4003C High Frequency RF PCB

RO4003C PCBs are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.

RO3003 PCB 10mil
Rogers RO3003 High Frequency PCB 2 Layer 10mil DK3.0 DF 0.001 PCB

Rogers RO3003 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices.

RO3010 PCB 10mil
Rogers RO3010 High Frequency 2-Layer 10mil Printed Circuit Board PCB

RO3010 laminates are competitively priced products with exceptional mechanical and electrical stability. This stability simplifies the design of broadband components and allows the materials to be used in a wide range of applications over a very broad range of frequencies.

25mil RO3210 PCB
Rogers RF PCB RO3210 25mil 0.635mm DK10.2 Immersion Gold

These RO3210 materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate.

RT/duroid 6035HTC
Rogers 6035 Double Sided 20mil Core With Immersion Gold PCB

RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

TC350 RF PCB
TC350 Rogers RF PCB 30mil Double Sided Corel With Immersion Gold

TC350 is designed to provide enhanced heat-transfer through “Best-In-Class” thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains/Efficiencies.

Rogers RO3035 High Frequency PCB
Rogers RO3035 High Frequency 2-Layer 10mil Circuit Board DK3.5 DF 0.0015

RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability.

© Copyright: 2022 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.

IPv6 network supported

IPv6 network supported

top

Leave A Message

Leave A Message

    If you have questions or suggestions,please leave us a message,we will reply you as soon as we can!

  • #
  • #
  • #