Call Us Now ! Tel : +86 755 27374946
Order Online Now ! Email : info@bichengpcb.com
TMM6 has an exceptionally low thermal
coefficient of dielectric constant.
Item NO.:
BIC-157-v107.0Order(MOQ):
1-10Payment:
T/TProduct Origin:
ChinaColor:
WhiteShipping Port:
ShenzhenLead Time:
7-10 days
Rogers TMM6 Microwave Printed Circuit Board 20mil 50mil 75mil DK6.0 RF PCB With Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description:
Rogers' TMM6 thermoset microwave laminates are ceramic, hydrocarbon, thermoset polymer composites designed for high PTH reliability stripline and microstrip applications. It has the dielectric constant of 6.0 and dissipation factor of 0.0023.
Its isotropic coefficients of thermal expansion is very closely matched to copper which results in production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM6 is approximately twice that of traditional PTFE/ceramic laminates, facilitating heat removal.
Since TMM6 is based on thermoset resins, and do not soften when heated. So wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.
Typical Applications
1. Chip testers
2. Dielectric polarizers and lenses
3. Filters and coupler
4. Global Positioning Systems Antennas
5. Patch Antennas
6. Power amplifiers and combiners
7. RF and microwave circuitry
8. Satellite communication systems
Our PCB Capability(TMM6)
PCB Material: | Ceramic, Hydrocarbon, Thermoset Polymer Composites |
Designation: | TMM6 |
Dielectric constant: | 6 |
Layer count: | Double Layer, Multilayer, Hybrid PCB |
Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
PCB thickness: | 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm) |
PCB size: | ≤400mm X 500mm |
Solder mask: | Green, Black, Blue, Yellow, Red etc. |
Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion silver, Pure gold plated etc.. |
Why Choose Us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡workshop, 30000㎡output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3
Typical Value of TMM6
Property | TMM6 | Direction | Units | Condition | Test Method | |
Dielectric Constant,εProcess | 6.0±0.08 | Z | 10 GHz | IPC-TM-650 2.5.5.5 | ||
Dielectric Constant,εDesign | 6.3 | - | - | 8GHz to 40 GHz | Differential Phase Length Method | |
Dissipation Factor (process) | 0.0023 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of dielectric constant | -11 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 | |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 | |
Volume Resistivity | 2 x 10^8 | - | Mohm.cm | - | ASTM D257 | |
Surface Resistivity | 1 x 10^9 | - | Mohm | - | ASTM D257 | |
Electrical Strength(dielectric strength) | 362 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 | |
Thermal Properties | ||||||
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 | |
Coefficient of Thermal Expansion - x | 18 | X | ppm/K | 0 to 140℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Y | 18 | Y | ppm/K | 0 to 140℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Coefficient of Thermal Expansion - Z | 26 | Z | ppm/K | 0 to 140℃ | ASTM E 831 IPC-TM-650, 2.4.41 | |
Thermal Conductivity | 0.72 | Z | W/m/K | 80℃ | ASTM C518 | |
Mechanical Properties | ||||||
Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 | |
Flexural Strength (MD/CMD) | 15.02 | X,Y | kpsi | A | ASTM D790 | |
Flexural Modulus (MD/CMD) | 1.75 | X,Y | Mpsi | A | ASTM D790 | |
Physical Properties | ||||||
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.06 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.2 | |||||
Specific Gravity | 2.37 | - | - | A | ASTM D792 | |
Specific Heat Capacity | 0.78 | - | J/g/K | A | Calculated | |
Lead-Free Process Compatible | YES | - | - | - | - |
MANUFACTURING PROCESS:
BICHNEG PCB WORKSHOP:
BICHNEG PCB CERTIFICATION:
BICHENG PCB MAIN COURIERS:
Previous:
Rogers TMM3 High Frequency PCB 15mil 30mil 60mil DK3.27 RF PCB With Immersion GoldNext:
RO4533 High Frequency Printed Circuit Board Rogers 20mil 30mil 60mil Antenna RF PCBIf you have questions or suggestions,please leave us a message,we will reply you as soon as we can!
Categories
New Products
Rogers RO3203 PCB 60mil 1.524mm Double sided High Frequency Circuit Material
F4BTMS350 PCB 6.35mm Thick F4B DK 3.5 with HASL Circuit Board
FR408HR PCB Isola 2.0mm Thick 4-layer Multilayer High TG Material Circuit Board
Rigid-flex PCB S1000-2M+Panasonic R-F777 Polyimide +FR4 Material
RO4003C LoPro PCB 60.7mil Rogers 4003C Low Profile with Immersion Gold Printed Circuit Board
RF-60A PCB Taconic 25mil 2-layer Rigid High Frequency Board with Immersion Tin
© Copyright: 2024 Shenzhen Bicheng Electronics Technology Co., Ltd.. All Rights Reserved.
IPv6 network supported