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Home Rogers PCB Board Rogers 4003C High Frequency PCB with 8mil 12mil 20mil 32mil 60mil Immersion Gold Silver tin OSP

Rogers 4003C High Frequency PCB with 8mil 12mil 20mil 32mil 60mil Immersion Gold Silver tin OSP


RO4003C materials are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.



  • Item NO.:

    BIC-086-v168.0
  • Order(MOQ):

    1-10
  • Payment:

    T/T
  • Price Range:1 - 50/$99
  • Price Range:1 - 50/$2.9
  • Product Origin:

    China
  • Shipping Port:

    Shenzhen
  • Lead Time:

    7-10 days
  • Product Detail


Rogers 4003C High Frequency PCB with 8mil, 12mil, 20mil, 32mil and 60mil Coating with Immersion Gold, Silver, tin and OSP

(PCB's are custom-made products, the picture and parameters shown are just for reference)



Here is the high frequency PCB built on RO4003C laminates.


RO4003C is a woven glass cloth reinforced hydrocarbon resin ceramic-filled laminate from Rogers Corporation, which has very similar electrical properties to PTFE and its processability is similar to epoxy resin (glass cloth) material.


Now let’s see the 5 advantages of RO4003C laminates.


5 reasons to using RO4003C PCB


1. Superior high frequency performance

RO4003C materials are hydrocarbon ceramic filled laminates, not PTFE which are designed to offer superior high frequency performance.


2. Low dielectric loss

Low loss results in excellent electrical performance and allows applications with high operating frequencies.


3. Stable electrical properties versus frequency

RO4003C material possesses the properties of RF microwave circuits, matching networks and controlled impedance transmission lines. The dielectric constant is stable over a broad frequency range (Chart DK vs. frequency).


DK vs. frequency


4. Low thermal coefficient of dielectric constant

The temperature coefficient of dielectric constant is among the lowest of any circuit board material (see Chart DK vs. Temperature). This allows the RO4003C to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer PCBs constructions and reliable plated through holes.


DK VS TEMP


5. Cost

RO4003C laminates can be fabricated using standard FR-4 processes, do not require speicalized via preparation prcoesses, can be processed by automated handling systems and scrubbing equipment used for copper surface preparation. This properties allow it can be using in volume manufacturing and get competitively priced.


Our PCB Capability (RO4003C)

PCB Material:

Glass reinforced hydrocarbon ceramic laminates

Code:

RO4003C

Dielectric constant:

3.38 ±0.05 (process)

3.55 (design)

Layer count:

1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed)

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

8mil (0.203mm), 12mil (0.305mm), 20mil (0.508mm)

32mil (0.813mm), 60mil (1.524mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, Immersion tin, OSP,etc.


Double sided RO4003C circuit boards are available in a variety of thicknesses, such as 12mil, 16mil, 20mil, 32mil and 60mil. It's used in a variety of typical and non-traditional microwave / radio frequency applications, such as base station antennas, power amplifiers, RFID, radar and sensors etc.


Double sided RO4003C PCB


The basic colour of RO4003C PCB is white.


Multilayer PCB

Multilayer circuit boards are built on different cores of RO4003C. For example, a 4-layer PCB on 2 cores of 32mil RO4003C, a 4-layer board on 12mil core and 20mil core of RO4003C etc.The core has fixed thickness which is very important to the electrical length of RF lines on the circuit board.


Hybrid PCB

In order to save production cost but not reduce signal loss in high frequency environment, mixed pressure production with FR-4 came into being. At present, the technology of mixed circuit board is mature and popular in the market.


Microsection of hybrid pcb


We specialize in provide you with prototype, small batches and mass production service.

If you have any requirements on this kind of PCB, please feel free to contact us.

Thank you for your reading.


Appendix: RO4003C Typical Value


RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃TMA A IPC-TM-650 2.4.24.3
Td 425 ℃TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes



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