Rogers
4003C High Frequency PCB with 8mil, 12mil, 20mil, 32mil and 60mil Coating with
Immersion Gold, Silver, tin and OSP
(PCB's
are custom-made products, the picture and parameters shown are just for
reference)
Here is the high frequency
PCB built on RO4003C laminates.
RO4003C is a
woven glass cloth reinforced hydrocarbon resin ceramic-filled laminate from
Rogers Corporation, which has very similar electrical properties to PTFE and
its processability is similar to epoxy resin (glass cloth) material.
Now let’s see the 5 advantages of RO4003C
laminates.
1. Superior high frequency performance
RO4003C materials are hydrocarbon
ceramic filled laminates, not PTFE which are designed to offer superior high
frequency performance.
2. Low dielectric loss
Low loss results in excellent electrical
performance and allows applications with high operating frequencies.
3. Stable electrical properties versus
frequency
RO4003C material possesses the properties of RF
microwave circuits, matching networks and controlled impedance transmission
lines. The dielectric constant is stable over a broad frequency range (Chart DK
vs. frequency).
4. Low thermal coefficient of dielectric
constant
The temperature coefficient of dielectric
constant is among the lowest of any circuit board material (see Chart DK vs.
Temperature). This allows the RO4003C to exhibit excellent dimensional
stability, a property needed for mixed dielectric multi-layer PCBs
constructions and reliable plated through holes.
5. Cost
RO4003C laminates can be fabricated using
standard FR-4 processes, do not require speicalized via preparation prcoesses,
can be processed by automated handling systems and scrubbing equipment used for
copper surface preparation. This properties allow it can be using in volume
manufacturing and get competitively priced.
Our PCB Capability (RO4003C)
|
PCB Material:
|
Glass reinforced hydrocarbon
ceramic laminates
|
|
Code:
|
RO4003C
|
|
Dielectric constant:
|
3.38 ±0.05 (process)
|
|
3.55 (design)
|
|
Layer count:
|
1 Layer, 2 Layer, Multilayer,
Hybrid type (Mixed)
|
|
Copper weight:
|
0.5oz (17 µm), 1oz (35µm), 2oz
(70µm)
|
|
PCB thickness:
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8mil (0.203mm), 12mil (0.305mm),
20mil (0.508mm)
|
|
32mil (0.813mm), 60mil (1.524mm)
|
|
PCB size:
|
≤400mm X 500mm
|
|
Solder mask:
|
Green, Black, Blue, Yellow, Red
etc.
|
|
Surface finish:
|
Bare copper, HASL, ENIG, Immersion
tin, OSP,etc.
|
Double sided RO4003C circuit boards are
available in a variety of thicknesses, such as 12mil, 16mil, 20mil, 32mil and
60mil. It's used in a variety of typical and non-traditional microwave / radio
frequency applications, such as base station antennas, power amplifiers, RFID,
radar and sensors etc.
The basic colour of RO4003C PCB is white.
Multilayer PCB
Multilayer circuit boards are built on different cores of
RO4003C. For example, a 4-layer PCB on 2 cores of 32mil RO4003C, a 4-layer
board on 12mil core and 20mil core of RO4003C etc.The core has
fixed thickness which is very important to the electrical length of RF lines on
the circuit board.
Hybrid PCB
In order to save production cost but not reduce
signal loss in high frequency environment, mixed pressure production with FR-4
came into being. At present, the technology of mixed circuit board is mature
and popular in the market.
We specialize in provide you with prototype,
small batches and mass production service.
If you have any requirements on this kind of
PCB, please feel free to contact us.
Thank you for your reading.
Appendix: RO4003C Typical Value
|
RO4003C
Typical Value
|
|
Property
|
RO4003C
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
3.38±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650
2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.55
|
Z
|
|
8 to 40 GHz
|
Differential
Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0027
0.0021
|
Z
|
|
10
GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650
2.5.5.5
|
|
Thermal Coefficient of ε
|
+40
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650
2.5.5.5
|
|
Volume Resistivity
|
1.7 x 1010
|
|
MΩ.cm
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Surface Resistivity
|
4.2 x 109
|
|
MΩ
|
COND A
|
IPC-TM-650
2.5.17.1
|
|
Electrical Strength
|
31.2(780)
|
Z
|
Kv/mm(v/mil)
|
0.51mm(0.020")
|
IPC-TM-650
2.5.6.2
|
|
Tensile Modulus
|
19,650(2,850)
19,450(2,821)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Tensile Strength
|
139(20.2)
100(14.5)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM
D 638
|
|
Flexural Strength
|
276
(40)
|
|
MPa
(kpsi)
|
|
IPC-TM-650
2.4.4
|
|
Dimensional Stability
|
<0.3
|
X,Y
|
mm/m
(mil/inch)
|
after etch+E2/150℃
|
IPC-TM-650
2.4.39A
|
|
Coefficient of Thermal Expansion
|
11
14
46
|
X
Y
Z
|
ppm/℃
|
-55℃to288℃
|
IPC-TM-650
2.4.41
|
|
Tg
|
>280
|
|
℃TMA
|
A
|
IPC-TM-650
2.4.24.3
|
|
Td
|
425
|
|
℃TGA
|
|
ASTM
D 3850
|
|
Thermal Conductivity
|
0.71
|
|
W/M/oK
|
80℃
|
ASTM
C518
|
|
Moisture Absorption
|
0.06
|
|
%
|
48hrs
immersion 0.060"
sample Temperature 50℃
|
ASTM
D 570
|
|
Density
|
1.79
|
|
gm/cm3
|
23℃
|
ASTM
D 792
|
|
Copper Peel Stength
|
1.05
(6.0)
|
|
N/mm
(pli)
|
after
solder float 1 oz.
EDC Foil
|
IPC-TM-650
2.4.8
|
|
Flammability
|
N/A
|
|
|
|
UL
94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
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