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Home Rogers PCB Board Rogers 3210 RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold

Rogers 3210 RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold

The high frequency circuit materials used by Rogers RO3210 are ceramic-filled laminates reinforced with woven fiberglass. 

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Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

The high frequency circuit materials used by Rogers RO3210 PCB are ceramic-filled laminates reinforced with woven fiberglass. These materials are designed to provide exceptional electrical performance as well as mechanical stability. Rogers 3210 laminates combine the surface smoothness of a non-woven PTFE laminate with the strength of a woven PTFE laminate. Because these materials can be fabricated into PCBs using standard PTFE circuit board processing techniques, they can be mass produced at competitive market prices. RO3210 substrate has a dielectric constant of 10.2 and a dissipation factor of 0.0027.

Reasons to Use RO3210 Laminate

For applications where using mechanically robust materials is necessary, the Rogers 3210 laminates offer a number of benefits. These benefits comprise:

  •  Great for use in applications requiring high frequency, which needs a high dielectric constant
  •  Ideal for portable and mobile devices that operates under harsh conditions
  •  It is less fragile and can be handled easily. This is because of the great rigidity of the material
  •  Provides higher yields during production as a result of the unique dimensional stability of the material
  •  With its smoother surface, it tolerates finer line etching
  •  Great for the construction of epoxy, complex, multi-layer boards as a result of stable and uniform mechanical and electrical properties
  •  Ideal for mounting surface assemblies due to low in-plane expansion

Rogers 3210 PCB 25mil

Typical applications:

1. Automotive collision avoidance systems

2. Automotive global positions satellite antennas

3. Base station infrastructure

4. Datalink on cable systems

5. Direct broadcast satellites

6. LMDS and wireless broadband

7. Microstrip patch antennas

8. Power backplanes

9. Remote meter readers

10. Wireless telecommunications systems

PCB Specifications

PCB SIZE 102 x 102mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 18µm(0.5 oz)+plate TOP layer
RO3210 1.270mm
copper ------- 18µm(0.5 oz)+plate BOT layer
Minimum Trace and Space: 6 mil / 4 mil
Minimum / Maximum Holes: 0.4 mm / 2.5 mm
Number of Different Holes: 8
Number of Drill Holes: 32
Number of Milled Slots: 0
Number of Internal Cutouts: NO
Impedance Control: no
Number of Gold finger: 0
Glass Epoxy:  RO3210 1.270mm
Final foil external:  1 oz
Final foil internal:  1 oz
Final height of PCB:  1.3 mm ±10%
Surface Finish Immersion gold
Solder Mask Apply To:  N/A
Solder Mask Color:  N/A
Solder Mask Type: N/A
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo:  N/A
VIA Plated through hole(PTH), minimum size 0.4mm.
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Data Sheet of Rogers 3210 (RO3210)

 RO3210 Typical Value
Property RO3210 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.5 Z 10 GHz 23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 10.8 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z 10 GHz 23℃ IPC-TM-650
Thermal Coefficient of ε -459 Z ppm/℃ 10 GHz 0℃to 100℃ IPC-TM-650
Dimensional Stability 0.8 X, Y mm/m COND A ASTM D257
Volume Resistivity 103 MΩ.cm COND A IPC
Surface Resistivity 103 COND A IPC
Tensile Modulus 579
kpsi 23℃ ASTM D 638
Water Absorption <0.1 - % D24/23 IPC-TM-650
Specific Heat 0.79 j/g/k Calculated
Thermal Conductivity 0.81 W/M/K 80℃ ASTM C518
Coefficient of Thermal Expansion
(-55 to 288℃)

ppm/℃ 23℃/50% RH IPC-TM-650
Td 500 TGA ASTM D3850
Density 3 gm/cm3
Copper Peel Stength 11 pli 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes




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