Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2
With Immersion Gold for Microstrip Patch Antennas
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
The high frequency circuit materials used by
Rogers RO3210 PCB are ceramic-filled laminates reinforced with woven fiberglass.
These materials are designed to provide exceptional electrical performance as
well as mechanical stability. Rogers 3210 laminates combine the surface smoothness
of a non-woven PTFE laminate with the strength of a woven PTFE laminate.
Because these materials can be fabricated into PCBs using standard PTFE circuit
board processing techniques, they can be mass produced at competitive market
prices. RO3210 substrate has a dielectric constant of 10.2 and a dissipation
factor of 0.0027.
Reasons to Use RO3210 Laminate
For applications where using mechanically
robust materials is necessary, the Rogers 3210 laminates offer a number of benefits.
These benefits comprise:
-
Great
for use in applications requiring high frequency, which needs a high dielectric
constant
-
Ideal
for portable and mobile devices that operates under harsh conditions
-
It
is less fragile and can be handled easily. This is because of the great
rigidity of the material
-
Provides
higher yields during production as a result of the unique dimensional stability
of the material
-
With
its smoother surface, it tolerates finer line etching
-
Great
for the construction of epoxy, complex, multi-layer boards as a result of
stable and uniform mechanical and electrical properties
-
Ideal
for mounting surface assemblies due to low in-plane expansion
Typical applications:
1. Automotive collision avoidance systems
2. Automotive global positions satellite
antennas
3. Base station infrastructure
4. Datalink on cable systems
5. Direct broadcast satellites
6. LMDS and wireless broadband
7. Microstrip patch antennas
8. Power backplanes
9. Remote meter readers
10. Wireless telecommunications systems
PCB Specifications
|
PCB SIZE
|
102 x
102mm=1PCS
|
|
BOARD TYPE
|
Double
sided PCB
|
|
Number
of Layers
|
2 layers
|
|
Surface
Mount Components
|
YES
|
|
Through
Hole Components
|
YES
|
|
LAYER STACKUP
|
copper
------- 18µm(0.5 oz)+plate TOP layer
|
|
RO3210 1.270mm
|
|
copper ------- 18µm(0.5 oz)+plate BOT layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
6
mil / 4 mil
|
|
Minimum
/ Maximum Holes:
|
0.4
mm / 2.5 mm
|
|
Number
of Different Holes:
|
8
|
|
Number
of Drill Holes:
|
32
|
|
Number
of Milled Slots:
|
0
|
|
Number
of Internal Cutouts:
|
NO
|
|
Impedance
Control:
|
no
|
|
Number
of Gold finger:
|
0
|
|
BOARD
MATERIAL
|
|
|
Glass
Epoxy:
|
RO3210
1.270mm
|
|
Final
foil external:
|
1
oz
|
|
Final
foil internal:
|
1
oz
|
|
Final
height of PCB:
|
1.3
mm ±10%
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion gold
|
|
Solder
Mask Apply To:
|
N/A
|
|
Solder
Mask Color:
|
N/A
|
|
Solder
Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of
Component Legend
|
N/A
|
|
Colour
of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated
through hole(PTH), minimum size 0.4mm.
|
|
FLAMIBILITY RATING
|
UL
94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline
dimension:
|
0.0059"
|
|
Board
plating:
|
0.0029"
|
|
Drill
tolerance:
|
0.002"
|
|
TEST
|
100%
Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email
file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide,
Globally.
|
Data Sheet of Rogers 3210 (RO3210)
|
RO3210 Typical Value
|
|
Property
|
RO3210
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric
Constant,εProcess
|
10.2±0.5
|
Z
|
|
10 GHz 23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
10.8
|
Z
|
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation Factor,tanδ
|
0.0027
|
Z
|
|
10
GHz 23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of ε
|
-459
|
Z
|
ppm/℃
|
10 GHz 0℃to 100℃
|
IPC-TM-650 2.5.5.5
|
|
Dimensional Stability
|
0.8
|
X,
Y
|
mm/m
|
COND A
|
ASTM D257
|
|
Volume Resistivity
|
103
|
|
MΩ.cm
|
COND A
|
IPC 2.5.17.1
|
|
Surface Resistivity
|
103
|
|
MΩ
|
COND A
|
IPC 2.5.17.1
|
|
Tensile Modulus
|
579
517
|
MD
CMD
|
kpsi
|
23℃
|
ASTM D 638
|
|
Water Absorption
|
＜0.1
|
-
|
%
|
D24/23
|
IPC-TM-650 2.6.2.1
|
|
Specific Heat
|
0.79
|
|
j/g/k
|
|
Calculated
|
|
Thermal Conductivity
|
0.81
|
|
W/M/K
|
80℃
|
ASTM C518
|
Coefficient of Thermal Expansion
(-55 to 288℃)
|
13
34
|
X,Y
Z
|
ppm/℃
|
23℃/50% RH
|
IPC-TM-650 2.4.4.1
|
|
Td
|
500
|
|
℃
|
TGA
|
ASTM D3850
|
|
Density
|
3
|
|
gm/cm3
|
|
|
|
Copper Peel Stength
|
11
|
|
pli
|
1oz,EDC After Solder
Float
|
IPC-TM 2.4.8
|
|
Flammability
|
V-0
|
|
|
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
|
|
|
|
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BICHENG PCB EQUIPMENT:
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