Rogers RO4350B High Frequency Printed Circuit
Board with 10mil, 20mil, 30mil and 60mil thick Coating with Immersion Gold
(PCB's
are custom-made products, the picture and parameters shown are just for
reference)
There is a high frequency
PCB built on Rogers 4350B laminates.
Rogers 4350B PCB is a woven glass cloth reinforced hydrocarbon resin ceramic-filled laminate
from Rogers Corporation, which
has very similar electrical properties to PTFE/fabric glass cloth material and
its processability is similar to epoxy resin/glass cloth material.
The Reason for
using RO4350B Laminates
1. Superior high frequency performance
Rogers 4350B materials are hydrocarbon ceramic
filled laminates, not PTFE which are designed to offer superior high frequency
performance.
2. Low dielectric loss
Low loss results in excellent electrical
performance and allows applications with high operating frequencies.
3. Stable electrical properties versus
frequency
RO4350B material possesses the properties of RF
microwave circuits, matching networks and controlled impedance transmission
lines. The dielectric constant is stable over a broad frequency range (Chart DK
vs. frequency).
4. Low thermal coefficient of dielectric
constant
The temperature coefficient of dielectric
constant is among the lowest of any circuit board material (see Chart DK vs.
Temperature), This allows the Rogers 4350B to exhibit excellent dimensional
stability, a property needed for mixed dielectric multi-layer PCBs
constructions and reliable plated through holes.
5. Cost
Rogers 4350B laminates can be fabricated using
standard FR-4 processes, do not require speicalized via preparation prcoesses,
can be processed by automated handling systems and scrubbing equipment used for
copper surface preparation. This properties allow it can be using in volume
manufacturing and get competitively priced.
Our PCB
Capability(RO4350B)
Double sided RO4350B circuit boards on are
available in a variety of thicknesses, such as 10mil, 20mil, 30mil and 60mil.
It's used in a variety of typical and non-traditional microwave / radio
frequency applications, such as base station antennas, attenuator, power
amplifiers, RFID, radar and sensors etc.
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PCB Material:
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Glass reinforced hydrocarbon
ceramic laminates
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Code:
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Rogers RO4350B
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Dielectric constant:
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3.48 ±0.05 (process)
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3.65 (design)
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Layer count:
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1 Layer, 2 Layer, Multilayer,
Hybrid type (Mixed)
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Copper weight:
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0.5oz (17 µm), 1oz (35µm), 2oz
(70µm)
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PCB thickness:
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10mil (0.254mm), 20mil (0.508mm)
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30mil (0.762mm), 60mil (1.524mm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue, Yellow, Red
etc.
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Surface finish:
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Bare copper, HASL, ENIG, Silver,
OSP,etc.
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Multilayer PCB
The multilayer PCB is made on core
of RO4350B, such as 4-layer board on 6.6mil core and 20mil core, 4-layer board
on 2 cores of 10mil. This is different from multilayer PCB on FR-4.The
core has fixed thickness which is very important to the electrical length of RF
lines on the circuit board.
Hybrid PCB
In order to save production cost without
reducing signal loss in high frequency environment, FR-4 glass fiber material
is mixed with RO4350B in multi-layer circuit board. The high frequency material
is used in signal layer and FR-4 glass fiber material is used in other layers.
The basic colour of RO4350B PCB is white.
We specialize in provide you with prototype,
small batches and mass production service.
If you have any requirements on this kind of
PCB, please feel free to contact us.
Appendix: RO4350B Typical Value
|
Property
|
RO4350B
|
Direction
|
Units
|
Condition
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Test Method
|
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Dielectric Constant,εProcess
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3.48±0.05
|
Z
|
|
10 GHz/23℃
|
IPC-TM-650 2.5.5.5 Clamped Stripline
|
|
Dielectric Constant,εDesign
|
3.66
|
Z
|
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8 to 40 GHz
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Differential Phase Length Method
|
|
Dissipation Factortan,δ
|
0.0037
0.0031
|
Z
|
|
10 GHz/23℃
2.5 GHz/23℃
|
IPC-TM-650 2.5.5.5
|
|
Thermal Coefficient of ε
|
+50
|
Z
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ppm/℃
|
-50℃to 150℃
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IPC-TM-650 2.5.5.5
|
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Volume Resistivity
|
1.2 x 1010
|
|
MΩ.cm
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COND A
|
IPC-TM-650 2.5.17.1
|
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Surface Resistivity
|
5.7 x109
|
|
MΩ
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COND A
|
IPC-TM-650 2.5.17.1
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Electrical Strength
|
31.2(780)
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Z
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Kv/mm(v/mil)
|
0.51mm(0.020")
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IPC-TM-650 2.5.6.2
|
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Tensile Modulus
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16,767(2,432)
14,153(2,053)
|
X
Y
|
MPa(ksi)
|
RT
|
ASTM D 638
|
|
Tensile Strength
|
203(29.5)
130(18.9)
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X
Y
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MPa(ksi)
|
RT
|
ASTM D 638
|
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Flexural Strength
|
255
(37)
|
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MPa
(kpsi)
|
|
IPC-TM-650 2.4.4
|
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Dimensional Stability
|
<0.5
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X,Y
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mm/m
(mil/inch)
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after etch+E2/150℃
|
IPC-TM-650 2.4.39A
|
|
Coefficient of Thermal Expansion
|
10
12
32
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X
Y
Z
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ppm/℃
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-55℃to288℃
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IPC-TM-650 2.4.41
|
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Tg
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>280
|
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℃TMA
|
A
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IPC-TM-650 2.4.24.3
|
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Td
|
390
|
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℃TGA
|
|
ASTM D 3850
|
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Thermal Conductivity
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0.69
|
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W/M/oK
|
80℃
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ASTM C518
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Moisture Absorption
|
0.06
|
|
%
|
48hrs immersion
0.060"
sample Temperature 50℃
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ASTM D 570
|
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Density
|
1.86
|
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gm/cm3
|
23℃
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ASTM D 792
|
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Copper Peel Stength
|
0.88
(5.0)
|
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N/mm
(pli)
|
after solder float 1 oz.
EDC Foil
|
IPC-TM-650 2.4.8
|
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Flammability
|
(3)V-0
|
|
|
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UL 94
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Lead-free Process Compatible
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Yes
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