RT/Duroid
5880 15mil 0.381mm Rogers High Frequency PCB Supplier
(Printed
Circuit Boards are custom-made products, the picture and parameters shown are
just for reference)
Rogers 5880 high frequency material is glass microfiber reinforced PTFE
composites which is designed for exacting stripline and microstrip circuit
applications. The exceptional dielectric constant uniformity results from its
randomly oriented microfibers.
The
dielectric constant of Rogers 5880 is uniform from panel to panel and is
constant over a wide frequency range. Its low dissipation factor extends the
usefulness of RT/duroid 5880 to Ku-band and above. Rogers 5880 materials are
easily cut, sheared and machined to shape. They are resistant to all solvents
and reagents, hot or cold, normally used in etching printed circuits or in
plating edges and holes.
This
PCB has a size of 160 x 70mm and is a double-sided board with two layers. It
includes both surface mount and through-hole components, and the layer stackup
consists of a copper layer with a thickness of 18um (0.5oz) on the top and
bottom, with 0.381mm Rogers RT/duroid 5880 in the middle.
The
technology used for this PCB includes a minimum trace and space of 4 mil and 15
mil, respectively, and a minimum and maximum hole size of 0.254 mm and 4.0mm,
respectively. It has 4 different types of holes, with a total number of 125
drill holes and no milled slots or internal cutouts.
The
typical applications are commercial airline broadband antennas, microstrip
circuits, stripline circuits, millimeter wave applications, military radar
systems, missile guidance systems and point to point digital radio antennas
etc.
PCB
Specifications：
|
PCB SIZE
|
160
x 70mm=1PCS
|
|
BOARD TYPE
|
Double sided PCB
|
|
Number of Layers
|
2
layers
|
|
Surface Mount Components
|
YES
|
|
Through Hole Components
|
YES
|
|
LAYER STACKUP
|
copper ------- 18um(0.5 oz)+plate TOP layer
|
|
RT/duroid 5880 0.381mm
|
|
copper ------- 18um(0.5oz) +
plate BOT Layer
|
|
TECHNOLOGY
|
|
|
Minimum Trace and Space:
|
4 mil / 15 mil
|
|
Minimum / Maximum Holes:
|
0.254 mm / 4.0mm
|
|
Number of Different Holes:
|
4
|
|
Number of Drill Holes:
|
125
|
|
Number of Milled Slots:
|
0
|
|
Number of Internal Cutouts:
|
0
|
|
Impedance Control:
|
no
|
|
Number of Gold finger:
|
0
|
|
BOARD MATERIAL
|
|
|
Glass Epoxy:
|
RT/duroid 5880 0.381mm
|
|
Final foil external:
|
1.0 oz
|
|
Final foil internal:
|
N/A
|
|
Final height of PCB:
|
0.4 mm ±0.1
|
|
PLATING AND COATING
|
|
|
Surface Finish
|
Immersion
gold
|
|
Solder Mask Apply To:
|
N/A
|
|
Solder Mask Color:
|
N/A
|
|
Solder Mask Type:
|
N/A
|
|
CONTOUR/CUTTING
|
Routing
|
|
MARKING
|
|
|
Side of Component Legend
|
N/A
|
|
Colour of Component Legend
|
N/A
|
|
Manufacturer
Name or Logo:
|
N/A
|
|
VIA
|
Plated through hole(PTH), minimum size 0.2mm. Via tented.
|
|
FLAMIBILITY RATING
|
UL 94-V0 Approval MIN.
|
|
DIMENSION TOLERANCE
|
|
|
Outline dimension:
|
0.0059"
|
|
Board plating:
|
0.0029"
|
|
Drill tolerance:
|
0.002"
|
|
TEST
|
100% Electrical Test prior shipment
|
|
TYPE OF ARTWORK TO BE SUPPLIED
|
email file, Gerber RS-274-X, PCBDOC etc
|
|
SERVICE AREA
|
Worldwide, Globally.
|
Data
sheet of Rogers RT/duroid 5880:
|
RT/duroid 5880 Typical Value
|
|
Property
|
RT/duroid 5880
|
Direction
|
Units
|
Condition
|
Test Method
|
|
Dielectric Constant,εProcess
|
2.20
2.20±0.02 spec.
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1 MHz
IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Dielectric Constant,εDesign
|
2.2
|
Z
|
N/A
|
8GHz to 40 GHz
|
Differential Phase
Length Method
|
|
Dissipation Factor,tanδ
|
0.0004
0.0009
|
Z
|
N/A
|
C24/23/50
C24/23/50
|
1
MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
|
|
Thermal Coefficient of ε
|
-125
|
Z
|
ppm/℃
|
-50℃to 150℃
|
IPC-TM-650 2.5.5.5
|
|
Volume Resistivity
|
2 x
107
|
Z
|
Mohm cm
|
C/96/35/90
|
ASTM D 257
|
|
Surface Resistivity
|
3 x 107
|
Z
|
Mohm
|
C/96/35/90
|
ASTM D 257
|
|
Specific Heat
|
0.96(0.23）
|
N/A
|
j/g/k
(cal/g/c)
|
N/A
|
Calculated
|
|
Tensile Modulus
|
Test
at 23℃
|
Test
at 100℃
|
N/A
|
MPa(kpsi)
|
A
|
ASTM D 638
|
|
1070(156)
|
450(65)
|
X
|
|
860(125)
|
380(55)
|
Y
|
|
Ultimate Stress
|
29(4.2)
|
20(2.9)
|
X
|
|
27(3.9）
|
18(2.6)
|
Y
|
|
Ultimate Strain
|
6
|
7.2
|
X
|
%
|
|
4.9
|
5.8
|
Y
|
|
Compressive Modulus
|
710(103)
|
500(73)
|
X
|
MPa(kpsi)
|
A
|
ASTM D 695
|
|
710(103)
|
500(73)
|
Y
|
|
940(136)
|
670(97)
|
Z
|
|
Ultimate Stress
|
27(3.9)
|
22(3.2)
|
X
|
|
29(5.3)
|
21(3.1)
|
Y
|
|
52(7.5)
|
43(6.3)
|
Z
|
|
Ultimate Strain
|
8.5
|
8.4
|
X
|
%
|
|
7.7
|
7.8
|
Y
|
|
12.5
|
17.6
|
Z
|
|
Moisture Absorption
|
0.02
|
N/A
|
%
|
0.62"(1.6mm)
D48/50
|
ASTM D 570
|
|
Thermal Conductivity
|
0.2
|
Z
|
W/m/k
|
80℃
|
ASTM C 518
|
|
Coefficient of Thermal Expansion
|
31
48
237
|
X
Y
Z
|
ppm/℃
|
0-100℃
|
IPC-TM-650 2.4.41
|
|
Td
|
500
|
N/A
|
℃TGA
|
N/A
|
ASTM D 3850
|
|
Density
|
2.2
|
N/A
|
gm/cm3
|
N/A
|
ASTM D 792
|
|
Copper Peel
|
31.2(5.5)
|
N/A
|
Pli(N/mm)
|
1oz(35mm)EDC
foil
after solder float
|
IPC-TM-650 2.4.8
|
|
Flammability
|
V-0
|
N/A
|
N/A
|
N/A
|
UL 94
|
|
Lead-free Process Compatible
|
Yes
|
N/A
|
N/A
|
N/A
|
N/A
|
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