Wangling TF300 25mil DK3.0 Laminate 2-layer PCB Immersion Gold Black Silkscreen

Wangling TF300 25mil DK3.0 Laminate 2-layer PCB Immersion Gold Black Silkscreen

Introduction

This is a 2-layer, 0.7mm thick rigid printed circuit board fabricated using Wangling TF300 high-frequency laminate. Designed for demanding microwave and millimeter-wave applications, this PCB leverages the unique properties of a PTFE-ceramic composite material to deliver exceptional electrical performance, thermal stability, and mechanical reliability. The following sections detail the TF300 board's construction, stackup, statistical data, and the underlying core material's properties, providing engineers and procurement specialists with the critical information needed for system integration and design validation.

2. PCB Construction Details

The table below summarizes the key physical and manufacturing parameters of the Wangling PCB, defining its form factor, fabrication rules, and finish specifications.

3. PCB Stackup

The stackup defines the layer structure and thickness of the materials used in the PCB construction.

4. PCB Statistics

The following table provides a quantitative breakdown of the board's components and features.

5. Conclusion

In summary, the 2-layer 25mil TF300 high-frequency PCB is a highly targeted high-performance circuit product integrating excellent dielectric performance, reliable mechanical properties and convenient manufacturability. Its standardized construction parameters, symmetrical 2-layer stackup and reasonable circuit layout fully meet the design and use requirements of microwave, millimeter-wave, aerospace and radar equipment.

The adoption of fiberglass-free TF300 PTFE-ceramic CCL endows the board with core competitive advantages such as low loss, stable Dk, wide temperature resistance and anti-radiation, which cannot be matched by ordinary FR-4 and conventional glass fiber high-frequency PCBs.

Strict IPC-Class-2 quality control and 100% pre-delivery electrical testing ensure the long-term stability of products in harsh working environments. With reasonable structure, reliable performance and global supply capability, this Wangling DK3.0 PCB can effectively meet the procurement and application demands of high-end high-frequency electronic equipment manufacturers, and is a preferred high-frequency circuit carrier for mid-to-high-end wireless communication, aerospace and defense electronic fields.

Supplementary Knowledge: Detailed Introduction to TF300 PTFE-Ceramic Copper Clad Laminate (CCL)

1. Basic Overview of TF Series & TF300 CCL

TFlaminateseries is a high-frequency copper clad laminate independently developed by Wangling, a composite material made of polytetrafluoroethylene (PTFE) resin and ceramic fillers, with no fiberglass cloth added in the formula. By adjusting the mixing ratio of ceramic and PTFE resin, the dielectric constant of the material can be precisely calibrated. Combined with exclusive special production processes, the series delivers outstanding dielectric stability, ultra-low loss and high overall reliability. In the product classification, TF refers to non-copper-clad bare substrate, TF-1 refers to single-sided copper-clad laminate, and TF-2 refers to double-sided copper-clad laminate.

The TF300 model is the classic low-Dk product of the TF series, with a fixed dielectric constant of 3.0, focusing on high-frequency, low-loss and high-stability application scenarios, and is widely matched with high-frequency PCBs for microwave and aerospace use.

2. Core Features of TF Series CCL

1)Wide and stable dielectric constant range: The Dk of the entire TF series covers 3~16, with mainstream models including 3.0, 6.0, 9.2, 9.6, 10.2 and 16. All models feature high Dk stability and ultra-low dielectric loss, suitable for different high-frequency signal design requirements.

2)Excellent high-frequency adaptability: Specially developed for microwave and millimeter-wave printed circuits, it effectively reduces signal transmission loss and ensures signal integrity in high-frequency bands.

3)Ultra-wide temperature resistance: The long-term continuous operating temperature ranges from -80℃to +200℃, far exceeding the temperature resistance limit of ordinary epoxy substrates, adapting to extreme cold and high-temperature working environments.

4)Customizable thickness: Standard substrate thickness ranges from 0.635 mm to 2.5 mm, and non-standard thickness can be customized according to customer demands.

5)Special environmental resistance: It has excellent radiation resistance and low outgassing performance, complying with the strict material standards of space and aerospace equipment.

6)Good processability: It can be processed using standard thermoplastic material manufacturing methods, compatible with mainstream PCB production lines, without special process transformation, and has high production efficiency and yield.

3. Complete Technical Data Sheet of TF300 CCL

The following table lists all typical performance parameters, test conditions, units and standard values of TF300 CCL, with all data tested in accordance with GB/T 12636-1990, IPC-TM-650 and GBT4722-2017 standards.

4. Copper Foil & Size Specifications of TF300 CCL

4.1 Copper Foil Configuration

TF300 is matched with ED (electrolytic) copper foil, with two conventional copper foil thickness options:

0.018 mm (0.5 oz) and 0.035 mm (1 oz).

The 1 oz copper foil (0.035 mm) is the most commonly used model for high-frequency PCBs, which balances current-carrying capacity and fine-line production capability. The copper foil has strong adhesion with the dielectric substrate, and still maintains high peel strength after humidity and temperature cycling tests, avoiding copper foil warpage and detachment.

4.2 Standard Product Dimensions

The standard blank substrate sizes of TF300 CCL are 150 mm×150 mm and 250 mm×250 mm, which can meet the cutting demands of most small and medium-sized PCBs. For special-size boards, customized cutting services are supported.

4.3 Standard Thickness & Tolerance (Dielectric Core / Total Thickness Including Copper)

Customers need to clearly mark "dielectric core thickness" or "total thickness including copper" when placing orders. The standard thickness and tolerance are shown in the table below:

 5. Material Composition & Testing Standard Explanation

TF300 copper cld laminate is composed of high-purity PTFE resin and uniformly dispersed nano-ceramic fillers, with no fiberglass cloth added. This formula fundamentally eliminates the signal phase shift and loss increase caused by glass fiber texture in high-frequency transmission. The dielectric constant test adopts the stripline method specified by GB/T 12636-1990 or IPC-TM650 2.5.5.5, and all electrical, mechanical and environmental reliability tests refer to IPC-TM-650 or GBT4722-2017. All data in the specification are typical measured values, providing objective reference for customers to select materials. Customers need to verify the adaptability of TF300 CCL according to actual application scenarios.

6. Main Application Fields of TF300 CCL

As a low-Dk and low-loss high-frequency CCL, TF300 is mainly used to produce high-frequency PCBs for high-end fields:

Aerospace on-board equipment

Space equipment, aircraft cabin electronic equipment

Various microwave antennas and phase array antennas

Early warning radars and airborne radars

Beamforming networks

satellite communication and navigation systems, as well as RF power amplifiers.

Its multiple advantages such as radiation resistance, low outgassing, wide temperature resistance and stable high-frequency performance make it irreplaceable in high-reliability high-frequency electronic equipment.