Rogers DiClad 870 Woven Fiberglass Reinforced
PTFE-based 31mil 93mil 125mil Microwave PCB
(Printed Circuit Boards are custom-made
products, the picture and parameters shown are just for reference)
General Description
DiClad 870 laminates are woven fiberglass/PTFE
composite materials for use as printed circuit board substrates. In comparison
to nonwoven fiberglass reinforced PTFE-based laminates of comparable dielectric
constants, the woven fiberglass reinforcement in DiClad 870 provides greater
dimensional stability.
Rogers DiClad 870 materials offer lower dielectric
constants (Dk) and dissipation factors at a similar thickness as other
laminates in the DiClad series by using fewer plies of woven fiberglass and a
higher ratio of PTFE content.
Features & Benefits
1.Dielectric
constant of 2.33 at 10GHz and 1 MHz
2.Dissipation
factor of .0013 at 10GHz
3.Lowest
moisture absorption among PTFE based composites
4.Stable
Dk over a wide frequency range ensuring easy design transition and scalability
of design
5.Low
Dk supports wider line widths for lower insertion loss
6.Copper
matched CTE in X and Y axis
7.Excellent
outgassing value in TML, CVCM and WVR.
8.Meets
requirements of UL94-V0
Our PCB Capability (DiClad 870)
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PCB Capability (DiClad 870)
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PCB material:
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Woven
Fiberglass reinforced PTFE Laminates
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Designation:
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DiClad 870
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Dielectric constant:
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2.3
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Layer count:
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Sinlge-sided PCB, Double-sided
PCB, Multi-layer PCB, Hybrid PCB
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Dielectric
thickness:
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31mil(0.787mm),
93mil (2.286mm), 125mil (3.175mm)
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Copper weight:
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1oz (35µm), 2oz (70µm)
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PCB size:
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≤400mm X 500mm
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Solder mask:
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Green, Black, Blue,
Red, Yellow etc.
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Surface
finish:
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Immersion
gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP,
Pure gold plated etc..
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Typical Applications
1. Commercial Phased Array Networks
2. Digital Radio Antennas
3. Filters, Couplers, LNAs
4. Guidance Systems
5. Low Loss Base Station Antennas
6. Radar Feed Networks
Our Advantages
1.Wide
ranges of high frequency materials: Rogers, Taconic, Wangling, Isola, Shengyi
etc.
2.16000㎡workshop; 30000㎡output capability per month; 8000 types of PCB's per month;
3.ISO9001,
ISO14001, ISO13485, UL certified manufacturing factory;
4.Quick
CADCAM checking and free PCB quotation;
5.More
than 20+ years of high frequency PCB experience;
6.Diversified
shipping method: FedEx, DHL, TNT, EMS;
7.No
MOQ, low cost for prototypes and small runs quantity;
8.Delivery
on time: >98% ; Customer complaint rate: <1%
Appendix: Data sheet of DiClad 870
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Property
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DiClad 870
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Condition
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Test Method
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Electrical Properties
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Dielectric Constant @ 10
GHz
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2.33
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C23/50
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IPC
TM-650 2.5.5.5
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Dielectric Constant @ 1
MHz
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2.33
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C23/50
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IPC
TM-650 2.5.5.3
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Dissipation Factor @ 10 GHz
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0.0013
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C23/50
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IPC
TM-650 2.5.5.5
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Dissipation Factor @ 1 MHz
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0.0009
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C23/50
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IPC
TM-650 2.5.5.3
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Thermal Coefficient of Er (ppm/°C)
|
-161
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-10°C
to +140°C
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IPC
TM-650 2.5.5.5
Adapted
|
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Volume Resistivity (MΩ-cm)
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1.5
x 109
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C96/35/90
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IPC
TM-650 2.5.17.1
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Surface Resistivity (MΩ)
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3.4
x 107
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C96/35/90
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IPC
TM-650 2.5.17.1
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Arc Resistance
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>180
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D48/50
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ASTM
D-495
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Dielectric Breakdown (kV)
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>45
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D48/50
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ASTM
D-149
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Mechanical Properties
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Peel Strength (lbs.per
inch)
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14
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After
Thermal Stress
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IPC
TM-650 2.4.8
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Tensile Modulus (kpsi)
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485(MD),
346(CD)
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A,
23°C
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ASTM
D-638
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Tensile Strength (kpsi)
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14.9(MD),
11.2 (CD)
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A,
23°C
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ASTM
D-882
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Compressive Modulus (kpsi)
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327
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A,
23°C
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ASTM
D-695
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Flexural Modulus (kpsi)
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437
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A,
23°C
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ASTM
D-790
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Thermal Properties
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Coefficient
of Thermal Expansion (ppm/°C)
X Axis
Y Axis
Z Axis
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17 29 217
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0°C to 100°C
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IPC TM-650
2.4.24 Mettler 3000 Thermomechanical
Analyzer
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Thermal Conductivity (W/mK)
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0.257
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100°C
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ASTM
E-1225
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Flammability UL
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Meets
requirements of UL94-V0
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C48/23/50,
E24/125
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UL
94 Vertical Burn IPC TM-650 2.3.10
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Physical Properties
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Density (g/cm3)
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2.26
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A,
23°C
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ASTM
D-792 Method A
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Water Absorption (%)
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0.02
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E1/105
+ D24/23
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MIL-S-13949H
3.7.7
IPC TM-650 2.6.2.2
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Outgassing Total
Mass Loss (%)
Collected Volatile Condensable Material (%) Water
Vapor Regain (%)
Visible Condensate (±)
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0.02 0.00 0.01 NO
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125°C,
≤ 10-6torr
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NASA
SP-R-0022A Maximum 1.00% Maximum 0.10%
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