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Home Rogers PCB Board Rogers DiClad 870 Woven Fiberglass Reinforced PTFE-based 31mil 93mil 125mil Microwave PCB

Rogers DiClad 870 Woven Fiberglass Reinforced PTFE-based 31mil 93mil 125mil Microwave PCB

DiClad 870 laminates offer lower dielectric constants (Dk) and dissipation factors at a similar thickness to other laminates in the DiClad® series.

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Rogers DiClad 870 Woven Fiberglass Reinforced PTFE-based 31mil 93mil 125mil Microwave PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

DiClad 870 laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. In comparison to nonwoven fiberglass reinforced PTFE-based laminates of comparable dielectric constants, the woven fiberglass reinforcement in DiClad 870 provides greater dimensional stability.

Rogers DiClad 870 materials offer lower dielectric constants (Dk) and dissipation factors at a similar thickness as other laminates in the DiClad series by using fewer plies of woven fiberglass and a higher ratio of PTFE content.

Features & Benefits

1.Dielectric constant of 2.33 at 10GHz and 1 MHz

2.Dissipation factor of .0013 at 10GHz

3.Lowest moisture absorption among PTFE based composites

4.Stable Dk over a wide frequency range ensuring easy design transition and scalability of design

5.Low Dk supports wider line widths for lower insertion loss

6.Copper matched CTE in X and Y axis

7.Excellent outgassing value in TML, CVCM and WVR.

8.Meets requirements of UL94-V0

Our PCB Capability (DiClad 870)

PCB Capability (DiClad 870)
PCB material: Woven Fiberglass reinforced PTFE Laminates
Designation: DiClad 870
Dielectric constant: 2.3
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 31mil(0.787mm), 93mil (2.286mm), 125mil (3.175mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP,                                           Pure gold plated etc..

DiClad 870 PCBs

Typical Applications

1. Commercial Phased Array Networks

2. Digital Radio Antennas

3. Filters, Couplers, LNAs

4. Guidance Systems

5. Low Loss Base Station Antennas

6. Radar Feed Networks

Applications DiClad 870

Our Advantages

1.Wide ranges of high frequency materials: Rogers, Taconic, Wangling, Isola, Shengyi etc.

2.16000㎡workshop; 30000㎡output capability per month; 8000 types of PCB's per month;

3.ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;

4.Quick CADCAM checking and free PCB quotation;

5.More than 20+ years of high frequency PCB experience;

6.Diversified shipping method: FedEx, DHL, TNT, EMS;

7.No MOQ, low cost for prototypes and small runs quantity;

8.Delivery on time: >98% ; Customer complaint rate: <1%

Appendix: Data sheet of DiClad 870

Property DiClad 870 Condition Test Method
Electrical Properties
Dielectric Constant  @ 10 GHz 2.33 C23/50 IPC TM-650
Dielectric Constant  @ 1 MHz 2.33 C23/50 IPC TM-650
Dissipation Factor @ 10 GHz 0.0013 C23/50 IPC TM-650
Dissipation Factor @ 1 MHz 0.0009 C23/50 IPC TM-650
Thermal Coefficient of Er (ppm/°C) -161 -10°C to +140°C IPC TM-650
Volume Resistivity (MΩ-cm) 1.5 x 109 C96/35/90 IPC TM-650
Surface Resistivity (MΩ) 3.4 x 107 C96/35/90 IPC TM-650
Arc Resistance >180 D48/50 ASTM D-495
Dielectric Breakdown (kV) >45 D48/50 ASTM D-149
Mechanical Properties
Peel Strength  (lbs.per inch) 14 After Thermal Stress IPC TM-650 2.4.8
Tensile Modulus (kpsi) 485(MD), 346(CD) A, 23°C ASTM D-638
Tensile Strength (kpsi) 14.9(MD), 11.2 (CD) A, 23°C ASTM D-882
Compressive Modulus (kpsi) 327 A, 23°C ASTM D-695
Flexural Modulus (kpsi) 437 A, 23°C ASTM D-790
Thermal Properties
Coefficient of Thermal Expansion (ppm/°C)                                                 X  Axis                                                          Y Axis                                                                   Z Axis 17                            29                          217 0°C to 100°C IPC TM-650 2.4.24         Mettler 3000                       Thermomechanical Analyzer
Thermal Conductivity (W/mK) 0.257 100°C ASTM E-1225
Flammability UL Meets requirements of UL94-V0 C48/23/50, E24/125 UL 94 Vertical Burn IPC TM-650 2.3.10
Physical Properties
Density (g/cm3) 2.26 A, 23°C ASTM D-792 Method A
Water Absorption (%) 0.02 E1/105 + D24/23 MIL-S-13949H 3.7.7
IPC TM-650
Outgassing                                       Total Mass Loss (%)                      Collected Volatile Condensable Material (%)                                       Water Vapor Regain (%)                    Visible Condensate (±)                            0.02                    0.00                                0.01                                      NO 125°C, ≤ 10-6torr NASA SP-R-0022A     Maximum 1.00%    Maximum 0.10%  




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